With ECH's SnLAYER analysis system, the coating thickness on metals is determined quickly and with high precision with only one single measurement. For this purpose, a new electrochemical method was developed, which is based on coulometric voltammetry and is oriented towards the standards DIN 1787 and DIN 40500, Part 5. The patented potential scan method enables the simultaneous determination of free and alloyed parts of coatings, e. g. tin on copper.

 

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Applications

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• Measurement of tin layer thickness on copper wires, copper sheets, wire strands
• Determination of alloyed and unalloyed tin
• Analysis of nickel, silver, copper and alloys on copper, steel, Percon and others
• Conductor board manufacture
• Wire and cable manufacture
• Quality management in rolling mills
• Applications in the metalworking industry

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Advantages

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• Complete measurement system for determination of the layer thickness of metal coatings
• Differentiation of free and bounded tinFast analysis
• Customer-friendly handling
• Intuitive software
• Comprehensive statistic module
• Wide dynamic range for various wire-diameters and layer thickness
• Universally applicable for different types of layer

  Information about the SnLayer

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